The radio station can provide an even controllable temperature and
the pressure then carries out the wafer to press fit the craft.the
metal linkage (Metal Bonding), the agglutination (Glue Bonding),
the anode linkage (Anodic Bonding) SOI the different agglutination
medium each must have the different technological conditions to
complete, cello the Taichi series wafer press fits the equipment to
be possible to provide the match the external mold train to
complete the different domain the technical utilization (Led, LD,
MEMS, WLP, 3D Package, Lens, SOI, KOS, PV). How just does the
deformation quantity drop to lowly, the Taichi series wafer will
press fit the equipment (Wafer Bonder) to find window of that leaf
of path perfect wafer linkage for you.